Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11926006 | Component manufacture and external inspection | Travis L. Mayberry, Matthew S. Kelly, Michael J. Arthur | 2024-03-12 |
| 11606865 | Method for forming channels in printed circuit boards by stacking slotted layers | Mikhail Pevzner, James E. Benedict, Andrew R. Southworth | 2023-03-14 |
| 11317502 | PCB cavity mode suppression | Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau +4 more | 2022-04-26 |
| 11122692 | Preparation of solder bump for compatibility with printed electronics and enhanced via reliability | James E. Benedict, Mikhail Pevzner, Thomas V. Sikina, Andrew R. Southworth | 2021-09-14 |
| 10999938 | Method of wire bonding a first and second circuit card | Mikhail Pevzner, Donald G. Hersey, Thomas J. Tellinghuisen, James E. Benedict | 2021-05-04 |
| 10775109 | Heat exchanger assembly | N. D. Nelson, Vincent J. Milano, Cameron B. Goddard, Matthew D. Thoren, Edward I. Holmes | 2020-09-15 |
| 10026674 | Cooling structure for integrated circuits and methods for forming such structure | Joseph M. Wahl, Travis L. Mayberry | 2018-07-17 |