Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6242802 | Moisture enhanced ball grid array package | Barry M. Miles, William B. Mullen, III | 2001-06-05 |
| 5696666 | Low profile exposed die chip carrier package | Barry M. Miles | 1997-12-09 |
| 5379186 | Encapsulated electronic component having a heat diffusing layer | Anthony B. Suppelsa, Anthony J. Suppelsa | 1995-01-03 |
| 5313365 | Encapsulated electronic package | Robert W. Pennisi, Frank J. Juskey, Glenn F. Urbish | 1994-05-17 |