Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6785960 | Wave solder application for ball grid array modules | Wesley M. Enroth, Jenny B. Porter | 2004-09-07 |
| 6462285 | Wave solder application for ball grid array modules with plugged vias | Wesley M. Enroth, Jenny B. Porter | 2002-10-08 |
| 6248961 | Wave solder application for ball grid array modules and solder plug | Wesley M. Enroth, Jenny B. Porter | 2001-06-19 |
| 5678752 | Wave soldering process | Mike Kaminsky, Richard Joseph Noreika, Daniel Stephen Potsko | 1997-10-21 |
| 5565033 | Pressurized injection nozzle for screening paste | Michael A. Gaynes, Mark V. Pierson, Jerzy M. Zalesinski | 1996-10-15 |
| 5545465 | Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits | Michael A. Gaynes, Mark V. Pierson, Jerzy M. Zalesinski | 1996-08-13 |
| 5478700 | Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head | Michael A. Gaynes, Mark V. Pierson, Jerzy M. Zalesinski | 1995-12-26 |