Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7326103 | Vertically adjustable chemical mechanical polishing head and method for use thereof | Kunihiko Sakurai, Huey-Ming Wang, Jun Liu, Peter Lao | 2008-02-05 |
| 7125326 | Apparatus and method for removing a CMP polishing pad from a platen | Cormac Walsh, Jun Liu, A. Ernesto Saldana | 2006-10-24 |
| 7118456 | Polishing head, retaining ring for use therewith and method fo polishing a substrate | Jiro Kajiwara | 2006-10-10 |
| 7004822 | Chemical mechanical polishing and pad dressing method | Huey-Ming Wang, Peter Lao | 2006-02-28 |
| 6966822 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control | Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2005-11-22 |
| 6916226 | Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof | Huey-Ming Wang | 2005-07-12 |
| 6893327 | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface | Jiro Kajiwara, Huey-Ming Wang, Junsheng Yang | 2005-05-17 |
| 6887132 | Slurry distributor for chemical mechanical polishing apparatus and method of using the same | Jiro Kajiwara, Jun Liu, Junsheng Yang, Ernesto Saldana, Cormac Walsh +1 more | 2005-05-03 |
| 6641461 | Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal | Huey-Ming Wang, David A. Hansen, Jiro Kajiwara | 2003-11-04 |
| 6623343 | System and method for CMP head having multi-pressure annular zone subcarrier material removal control | Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-09-23 |
| 6558232 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control | Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-05-06 |
| 6527625 | Chemical mechanical polishing apparatus and method having a soft backed polishing head | Jiro Kajiwara, David A. Hansen | 2003-03-04 |
| 6506105 | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control | Jiro Kajiwara, Huey-Ming Wang, David A. Hansen, Alejandro Reyes | 2003-01-14 |
| 6309290 | Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control | Huey-Ming Wang, Scott Chin, John Geraghty, William Dyson, Jr., Tanlin Dickey | 2001-10-30 |