Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923151 | Structural lead frame | John Bultitude, Lonnie G. Jones | 2024-03-05 |
| 11744018 | Component assemblies and embedding for high density electronics | John Bultitude, Peter Blais, James A. Burk, Hunter Hayes, Allen Templeton +2 more | 2023-08-29 |
| 10984955 | Electronic component structures with reduced microphonic noise | John Bultitude, John E. McConnell | 2021-04-20 |
| 10790094 | Method of forming a leadless stack comprising multiple components | John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill | 2020-09-29 |
| 10757811 | Higher density multi-component and serial packages | James A. Burk, John Bultitude | 2020-08-25 |
| 10757810 | High density multi-component packages | John Bultitude, John E. McConnell | 2020-08-25 |
| 10707145 | High density multi-component packages | John Bultitude, John E. McConnell | 2020-07-07 |
| 10681814 | High density multi-component packages | John Bultitude, John E. McConnell | 2020-06-09 |
| 10381162 | Leadless stack comprising multiple components | John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill | 2019-08-13 |
| 10366836 | Electronic component structures with reduced microphonic noise | John Bultitude, John E. McConnell | 2019-07-30 |
| 10224149 | Bulk MLCC capacitor module | John E. McConnell, John Bultitude, Garry L. Renner | 2019-03-05 |
| 10178770 | Higher density multi-component and serial packages | James A. Burk, John Bultitude | 2019-01-08 |
| 9805872 | Multiple MLCC modules | John E. McConnell, John Bultitude, Garry L. Renner | 2017-10-31 |