Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10212567 | User device, base device and system utilizing audio signal to transmit data, and method thereof | Min-Chun Lin, Feng-Hui Kuan | 2019-02-19 |
| 9661442 | Method and apparatus for transmitting digital contents | Min-Chun Lin, Feng-Hui Kuan, Ray-I Chang, Jing-Fa Tsai, Chao-Nan Wang +1 more | 2017-05-23 |
| 6567270 | Semiconductor chip package with cooling arrangement | Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more | 2003-05-20 |
| 6499648 | Method and device for making a metal bump with an increased height | Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more | 2002-12-31 |
| 6390356 | Method of forming cylindrical bumps on a substrate for integrated circuits | Wen-Lo Shieh, Yung-Cheng Chuang, Chia-Chieh Hu, Hui-Pin Chen, Ning Huang +4 more | 2002-05-21 |
| 6358834 | Method of forming bumps on wafers or substrates | Wen-Lo Shieh, Yung-Cheng Chuang, Hsuan-Jui Chang, Hui-Pin Chen, Ning Huang +4 more | 2002-03-19 |
| 6274491 | Process of manufacturing thin ball grid array substrates | Wan Le Xie, Yung-Cheng Chuang, Ning Huang, Chung-Ming Chang, Hui-Pin Chen +4 more | 2001-08-14 |