Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8946878 | Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor | Chee Keong Chin, Jae Hak Yee, Yu Feng Feng | 2015-02-03 |
| 8018039 | Integrated circuit package system with stacked devices | Jae Hak Yee, Yong Yong Xia, Jun Xu | 2011-09-13 |