Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211774 | Lead stabilization in semiconductor packages | Ela Mia Cadag, Aaron Cadag | 2025-01-28 |
| 12094725 | Leadframe package with pre-applied filler material | Jefferson Talledo | 2024-09-17 |
| 11227776 | Leadframe package with pre-applied filler material | Jefferson Talledo | 2022-01-18 |
| 10672689 | Protection from ESD during the manufacturing process of semiconductor chips | Tito Mangaoang, Jefferson Talledo | 2020-06-02 |
| 10388594 | Protection from ESD during the manufacturing process of semiconductor chips | Tito Mangaoang, Jefferson Talledo | 2019-08-20 |
| 9578744 | Leadframe package with pre-applied filler material | Jefferson Talledo | 2017-02-21 |
| 9258890 | Support structure for stacked integrated circuit dies | Rammil Seguido, Emmanuel Angeles | 2016-02-09 |