| 6567270 |
Semiconductor chip package with cooling arrangement |
Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more |
2003-05-20 |
| 6499648 |
Method and device for making a metal bump with an increased height |
Wen-Lo Shieh, Ning Huang, Hui-Pin Chen, Hua-Wen Chiang, Chung-Ming Chang +4 more |
2002-12-31 |
| 6390356 |
Method of forming cylindrical bumps on a substrate for integrated circuits |
Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Chia-Chieh Hu, Hui-Pin Chen +4 more |
2002-05-21 |
| 6358834 |
Method of forming bumps on wafers or substrates |
Wen-Lo Shieh, Fu-Yu Huang, Yung-Cheng Chuang, Hsuan-Jui Chang, Hui-Pin Chen +4 more |
2002-03-19 |
| 6274491 |
Process of manufacturing thin ball grid array substrates |
Wan Le Xie, Fu-Yu Huang, Yung-Cheng Chuang, Ning Huang, Chung-Ming Chang +4 more |
2001-08-14 |