Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6875558 | Integration scheme using self-planarized dielectric layer for shallow trench isolation (STI) | Frederic Gaillard, Ellie Yieh | 2005-04-05 |
| 6753270 | Process for depositing a porous, low dielectric constant silicon oxide film | Frederic Gaillard | 2004-06-22 |
| 6733955 | Methods for forming self-planarized dielectric layer for shallow trench isolation | Frederic Gaillard | 2004-05-11 |
| 6703321 | Low thermal budget solution for PMD application using sacvd layer | Frederic Gaillard | 2004-03-09 |
| 6602806 | Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film | Li-Qun Xia, Frederic Gaillard, Ellie Yieh, Tian-Hoe Lim | 2003-08-05 |