Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11702520 | Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee | 2023-07-18 |
| 11515245 | Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same | Minsu Jeong, You-Jin Kyung, Byung Ju Choi, Woo Jae Jeong, Kwang Joo Lee | 2022-11-29 |