Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355423 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Aaron Cadag, Frederick Arellano | 2022-06-07 |
| 10910295 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Aaron Cadag, Ela Mia Cadag | 2021-02-02 |
| 10796984 | Leadframe having a conductive layer protruding through a lead recess | Rennier Rodriguez, Raymond Albert Narvadez | 2020-10-06 |
| 10541196 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Aaron Cadag, Ela Mia Cadag | 2020-01-21 |
| 10483191 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Aaron Cadag, Frederick Arellano | 2019-11-19 |
| 10079198 | QFN pre-molded leadframe having a solder wettable sidewall on each lead | Aaron Cadag, Ela Mia Cadag | 2018-09-18 |