Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7528007 | Methods for assembling semiconductor devices and interposers | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2009-05-05 |
| 7489028 | Die package | Lim Thiam Chyc | 2009-02-10 |
| 7274095 | Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2007-09-25 |
| 6919645 | Die package | Lim Thiam Chyc | 2005-07-19 |
| 6825572 | Die package | Lim Thiam Chye | 2004-11-30 |
| 6746894 | Ball grid array interposer, packages and methods | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2004-06-08 |