| RE40112 |
Semiconductor package and method for fabricating the same |
Won Sun Shin, Sang Ho Lee, Seon Goo Lee, Vincent DiCaprio |
2008-02-26 |
| 7211900 |
Thin semiconductor package including stacked dies |
Won Sun Shin, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio |
2007-05-01 |
| 7190071 |
Semiconductor package and method for fabricating the same |
Won Sun Shin, Seon Goo Lee, Tae Hoan Jang, Vincent DiCaprio |
2007-03-13 |
| 6982488 |
Semiconductor package and method for fabricating the same |
Won Sun Shin, Soon Goo Lee, Il Kwon Shim, Vincent DiCaprio |
2006-01-03 |
| 6798049 |
Semiconductor package and method for fabricating the same |
Won Sun Shin, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio |
2004-09-28 |
| 6717248 |
Semiconductor package and method for fabricating the same |
Won Sun Shin, Seon Goo Lee, Tae Hoan Jang, Vincent DiCaprio |
2004-04-06 |
| 6515356 |
Semiconductor package and method for fabricating the same |
Won Sun Shin, Seon Goo Lee, Tae Hoan Jang, Vincent DiCaprio |
2003-02-04 |