Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10968348 | Laser-releasable bonding materials for 3-D IC applications | Xiao Liu, Qi Wu, Rama Puligadda, Baron Huang | 2021-04-06 |
| 9865490 | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes | Gu Xu, Debbie Blumenshine, Baron Huang, Andrew Wong | 2018-01-09 |
| 9827740 | Polyimides as laser release materials for 3-D IC applications | Xiao Liu, Tony D. Flaim, Xing-Fu Zhong, Qi Wu | 2017-11-28 |
| 9496164 | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes | Gu Xu, Debbie Blumenshine | 2016-11-15 |
| 8865599 | Self-leveling planarization materials for microelectronic topography | Xie Shao, Michelle Fowler, Tingji Tang | 2014-10-21 |
| 8771442 | Cyclic olefin compositions for temporary wafer bonding | Wenbin Hong, Tony D. Flaim, Rama Puligadda | 2014-07-08 |
| 8221571 | Cyclic olefin compositions for temporary wafer bonding | Wenbin Hong, Tony D. Flaim, Rama Puligadda | 2012-07-17 |
| 8092628 | Cyclic olefin compositions for temporary wafer bonding | Wenbin Hong, Tony D. Flaim, Rama Puligadda | 2012-01-10 |