| 12381170 |
Temporary bonding and debonding process to prevent deformation of metal connection in thermocompression bonding |
Chia-Hsin Lee, Alice Guerrero, Arthur O. Southard, Chen-Yu Wu |
2025-08-05 |
| 12085458 |
Temperature sensor probe |
Guokuan Liang, Xiaojian Wang, Wenjie Wu |
2024-09-10 |
| 12024594 |
Multifunctional materials for temporary bonding |
Luke M. Prenger, Qi Wu |
2024-07-02 |
| 11610801 |
Laser-releasable bonding materials for 3-D IC applications |
Luke M. Prenger, Arthur O. Southard, Qi Wu |
2023-03-21 |
| 10968348 |
Laser-releasable bonding materials for 3-D IC applications |
Qi Wu, Rama Puligadda, Dongshun Bai, Baron Huang |
2021-04-06 |
| 9827740 |
Polyimides as laser release materials for 3-D IC applications |
Dongshun Bai, Tony D. Flaim, Xing-Fu Zhong, Qi Wu |
2017-11-28 |
| 8208400 |
Method for testing wireless connection of electronic device |
Wen-Yi Wu, Wen Deng |
2012-06-26 |