Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381170 | Temporary bonding and debonding process to prevent deformation of metal connection in thermocompression bonding | Chia-Hsin Lee, Alice Guerrero, Chen-Yu Wu, Xiao Liu | 2025-08-05 |
| 11610801 | Laser-releasable bonding materials for 3-D IC applications | Luke M. Prenger, Qi Wu, Xiao Liu | 2023-03-21 |
| 10304720 | Laser ablative dielectric material | Christina R. Matos-Perez, Tony D. Flaim, Lisa M. Kirchner, Deborah Blumenshine | 2019-05-28 |