Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10968348 | Laser-releasable bonding materials for 3-D IC applications | Xiao Liu, Qi Wu, Rama Puligadda, Dongshun Bai | 2021-04-06 |
| 9865490 | Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes | Dongshun Bai, Gu Xu, Debbie Blumenshine, Andrew Wong | 2018-01-09 |