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System and method for real time digitization of hand written input data |
Prashant Mohanan, Piyush Agarwalla, Aniket Roy, Sumanta Saha, SANTOSH KUMAR MOHAN +2 more |
2021-08-10 |
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Computer platform for development and deployment of sensor data based applications and services |
Prateep Misra, Arpan Pal, Balamuralidhar Purushothaman, Chirabrata Bhaumik, Venkatramanan Siva Subrahmanian +4 more |
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Computer platform for development and deployment of sensor-driven vehicle telemetry applications and services |
Prateep Misra, Arpan Pal, Balamuralidhar Purushothaman, Chirabrata Bhaumik, Venkatramanan Siva Subrahmanian +2 more |
2018-06-05 |
| 5987553 |
Adaptor board interconnection for a processor board and motherboard |
Andrew Moore |
1999-11-16 |
| 5946544 |
Circuit board-mounted IC package cooling and method |
Scott Estes |
1999-08-31 |
| 5835357 |
Ceramic integrated circuit package with optional IC removably mounted thereto |
Thomas J. Kocis |
1998-11-10 |
| 5714789 |
Circuit board-mounted IC package cooling apparatus |
Scott Estes |
1998-02-03 |
| 5675183 |
Hybrid multichip module and methods of fabricating same |
David Lunsford |
1997-10-07 |
| 5625227 |
Circuit board-mounted IC package cooling apparatus |
Scott Estes |
1997-04-29 |
| 5623594 |
Embedded thermistor for on-board thermal monitoring of electrical components |
— |
1997-04-22 |
| 5593322 |
Leadless high density connector |
Victor Key Pecone |
1997-01-14 |
| 5576519 |
Anisotropic interconnect methodology for cost effective manufacture of high density printed wiring boards |
— |
1996-11-19 |
| 5567295 |
Method and apparatus for making staggered blade edge connectors |
Victor Key Pecone |
1996-10-22 |
| 5463191 |
Circuit board having an improved fine pitch ball grid array and method of assembly therefor |
James S. Bell |
1995-10-31 |
| 5459287 |
Socketed printed circuit board BGA connection apparatus and associated methods |
— |
1995-10-17 |
| 5456004 |
Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards |
— |
1995-10-10 |
| 5451720 |
Circuit board thermal relief pattern having improved electrical and EMI characteristics |
H. Scott Estes, David Staggs |
1995-09-19 |
| 5424492 |
Optimal PCB routing methodology for high I/O density interconnect devices |
Robert Petty, Michael D. Ohlinger, Joseph Daniel Mallory |
1995-06-13 |
| 5400220 |
Mechanical printed circuit board and ball grid array interconnect apparatus |
— |
1995-03-21 |
| 5392980 |
Method and apparatus for reworking ball grid array packages to allow reuse of functional devices |
Scott Estes, James S. Bell |
1995-02-28 |
| 5276955 |
Multilayer interconnect system for an area array interconnection using solid state diffusion |
David B. Noddin, Robin E. Gorrell, William George Petefish, Kevin L. Stumpe, Boydd Piper +2 more |
1994-01-11 |