| 9147625 |
Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device |
Yusaku Shimizu, Takeshi Matsumura, Eiji Toyoda, Tsuyoshi Torinari |
2015-09-29 |
| 8841757 |
Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device |
Takeshi Matsumura, Koichi Inoue, Miki Morita |
2014-09-23 |
| 8524007 |
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus |
Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata |
2013-09-03 |
| 8475600 |
Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus |
Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata |
2013-07-02 |
| 7793668 |
Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
Makoto Namikawa, Yoshio Terada, Jirou Nukaga, Eiji Toyoda, Hirofumi Fujii +4 more |
2010-09-14 |
| 7575812 |
Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor |
Yoshio Terada, Hirofumi Fujii, Makoto Namikawa, Yasuhiro Amano |
2009-08-18 |
| 6889432 |
Method of manufacturing double-sided circuit board |
Toshiki Naito, Yoshifumi Shinogi |
2005-05-10 |
| 6798487 |
Liquid crystal cell substrate including resin substrate, gas barrier layer, crosslinked resin layer and polarizing layer |
Akira Ohtani, Takashi Yamaoka, Hiroyuki Yoshimi |
2004-09-28 |