Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5955782 | Apparatus and process for improved die adhesion to organic chip carriers | Stephen J. Kosteva, William J. Rudik, David J. Russell, Jonathan C. Whitcomb | 1999-09-21 |
| 5869356 | Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate | James W. Fuller, Mary Beth Fletcher, Joseph Alphonse Kotylo, Jeffrey Alan Knight, Allen F. Moring | 1999-02-09 |
| 5784260 | Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate | James W. Fuller, Mary Beth Fletcher, Joseph Alphonse Kotylo, Jeffrey Alan Knight, Allen F. Moring | 1998-07-21 |