Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12364038 | Sensor die package | Yiying KUO | 2025-07-15 |
| 12356743 | Slanted glass edge for image sensor package | Laurent Herard | 2025-07-08 |
| 12136608 | Multi-chip package | Yong Chen | 2024-11-05 |
| 11996397 | Wafer level proximity sensor | — | 2024-05-28 |
| 11942496 | Slanted glass edge for image sensor package | Laurent Herard | 2024-03-26 |
| 11908831 | Method for manufacturing a wafer level chip scale package (WLCSP) | Chun Yi Teng | 2024-02-20 |
| 11828875 | Proximity sensor with integrated ALS | — | 2023-11-28 |
| 11742437 | WLCSP with transparent substrate and method of manufacturing the same | Yiying KUO | 2023-08-29 |
| 11585847 | Crack detection integrity check | Pedro Jr Santos PERALTA | 2023-02-21 |
| 11581280 | WLCSP package with different solder volumes | — | 2023-02-14 |
| 11581289 | Multi-chip package | Yong Chen | 2023-02-14 |
| 11562937 | Semiconductor package with protected sidewall and method of forming the same | Yun Liu | 2023-01-24 |
| 11527511 | Electronic device comprising a support substrate and stacked electronic chips | Jean-Michel Riviere | 2022-12-13 |
| 11502029 | Thin semiconductor chip using a dummy sidewall layer | Laurent Herard, David Parker | 2022-11-15 |
| 11404355 | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | Rennier Rodriguez, Bryan Christian Bacquian, Maiden Grace Maming | 2022-08-02 |
| 11366156 | Crack detection integrity check | Pedro Jr Santos PERALTA | 2022-06-21 |
| 11270946 | Package with electrical interconnection bridge | Yong Chen | 2022-03-08 |
| 11226399 | Proximity sensor with integrated ALS | — | 2022-01-18 |
| 11193821 | Ambient light sensor with light protection | Laurent Herard | 2021-12-07 |
| 11069667 | Wafer level proximity sensor | — | 2021-07-20 |
| 10910287 | Semiconductor package with protected sidewall and method of forming the same | Yun Liu | 2021-02-02 |
| 10763194 | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | Rennier Rodriguez, Bryan Christian Bacquian, Maiden Grace Maming | 2020-09-01 |
| 10422860 | Proximity sensor with integrated ALS | — | 2019-09-24 |
| 10147834 | Overmold proximity sensor and associated methods | Laurent Herard | 2018-12-04 |
| 9793427 | Air venting on proximity sensor | — | 2017-10-17 |