CT

Chun Yi Teng

SS Stmicroelectronics Sa: 1 patents #66 of 146Top 50%
📍 Seletar Hills, SG: #4 of 8 inventorsTop 50%
Overall (All Time): #2,478,860 of 4,157,543Top 60%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11908831 Method for manufacturing a wafer level chip scale package (WLCSP) David Gani 2024-02-20