DD

David Frederick Diefenderfer

IBM: 2 patents #32,839 of 70,183Top 50%
Overall (All Time): #2,221,586 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6171873 Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information Ronald L. Mendelson, Robert F. Cook, Eric G. Liniger, John Blondin, Donald W. Brouillette 2001-01-09
5888838 Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information Ronald L. Mendelson, Robert F. Cook, Eric G. Liniger, John Blondin, Donald W. Brouillette 1999-03-30