Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8946912 | Active area bonding compatible high current structures | John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more | 2015-02-03 |
| 8652960 | Active area bonding compatible high current structures | John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more | 2014-02-18 |
| 8569896 | Active area bonding compatible high current structures | John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more | 2013-10-29 |
| 8274160 | Active area bonding compatible high current structures | John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more | 2012-09-25 |
| 7795130 | Active area bonding compatible high current structures | John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more | 2010-09-14 |
| 7224074 | Active area bonding compatible high current structures | John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenic +1 more | 2007-05-29 |
| 7181306 | Enhanced plasma etch process | — | 2007-02-20 |
| 7005369 | Active area bonding compatible high current structures | John T. Gasner, Michael D. Church, Sameer D. Parab, Paul E. Bakeman, Jr., Robert Lomenick +1 more | 2006-02-28 |
| 6130172 | Radiation hardened dielectric for EEPROM | Robert T. Fuller, Howard L. Evans, Michael Morrison, Robert K. Lowry | 2000-10-10 |
| 5837603 | Planarization method by use of particle dispersion and subsequent thermal flow | Jack H. Linn, John J. Hackenberg | 1998-11-17 |
| 5808353 | Radiation hardened dielectric for EEPROM | Robert T. Fuller, Howard L. Evans, Michael Morrison, Robert K. Lowry | 1998-09-15 |
| 5279850 | Gas phase chemical reduction of metallic branding layer of electronic circuit package for deposition of branding ink | Jack H. Linn, Martin Walter | 1994-01-18 |