Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7531842 | Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate | — | 2009-05-12 |
| 7122416 | Method for forming a filled trench in a semiconductor layer of a semiconductor substrate, and a semiconductor substrate with a semiconductor layer having a filled trench therein | William Nevin | 2006-10-17 |
| 7045869 | Semiconductor wafer comprising micro-machined components | Stephen Brown, Scott C. Blackstone | 2006-05-16 |
| 7041528 | Method for forming a micro-mechanical component in a semiconductor wafer, and a semiconductor wafer comprising a micro-mechanical component formed therein | Scott Limb | 2006-05-09 |
| 6964882 | Fabricating complex micro-electromechanical systems using a flip bonding technique | Chang-Han Yun, Lawrence E. Felton, Maurice S. Karpman, John A. Yasaitis, Michael Judy | 2005-11-15 |
| 6933163 | Fabricating integrated micro-electromechanical systems using an intermediate electrode layer | Chang-Han Yun, Lawrence E. Felton, Maurice S. Karpman, John A. Yasaitis, Michael Judy | 2005-08-23 |
| 6818564 | Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrate | — | 2004-11-16 |
| 6797591 | Method for forming a semiconductor device and a semiconductor device formed by the method | Stephen Brown, Scott C. Blackstone | 2004-09-28 |
| 6723579 | Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor wafer | Stephen Brown, Scott C. Blackstone | 2004-04-20 |