Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165982 | Semiconductor package structure and method for manufacturing the same | Hsu-Nan FANG | 2024-12-10 |
| 12142576 | Semiconductor package structure and method for manufacturing the same | Hsu-Nan FANG | 2024-11-12 |
| 11712859 | Light-weight flexible high-thermal-conductivity nano-carbon composite film and method for preparing same | Qianli LIU, Feng Shen, Xiaolei Wang, Jiang Pan, Xufeng Hao +1 more | 2023-08-01 |
| 11605597 | Semiconductor package structure and method for manufacturing the same | Hsu-Nan FANG | 2023-03-14 |
| 11404380 | Semiconductor package structure and method for manufacturing the same | Hsu-Nan FANG | 2022-08-02 |
| 11257788 | Semiconductor device package with stacked die having traces on lateral surface | Hsu-Nan FANG | 2022-02-22 |
| 11211319 | Device structure | Hsu-Nan FANG, Chen Yuan Weng | 2021-12-28 |
| 11139252 | Semiconductor package and method for manufacturing the same | Hsu-Nan FANG, Yung-I Yeh | 2021-10-05 |
| 10886223 | Semiconductor package | Hsu-Nan FANG | 2021-01-05 |
| 10797019 | Semiconductor package and method for manufacturing the same | Hsu-Nan FANG | 2020-10-06 |
| 10797022 | Semiconductor device package and method of manufacturing the same | Hsu-Nan FANG, Yung-I Yeh, Ming-Chiang Lee | 2020-10-06 |
| 10593630 | Semiconductor package and method for manufacturing the same | Hsu-Nan FANG, Yung-I Yeh | 2020-03-17 |
| 10475775 | Semiconductor package device and method of manufacturing the same | Hsu-Nan FANG | 2019-11-12 |
| 10014268 | Semiconductor chip, semiconductor device and manufacturing process for manufacturing the same | Hung-Chun KUO, Chun-Chin Huang | 2018-07-03 |
| 9911709 | Semiconductor device and semiconductor manufacturing process | Wei-Hang Tai, Pin-Ha Chuang | 2018-03-06 |