| 8125063 |
COL package having small chip hidden between leads |
— |
2012-02-28 |
| 8040690 |
Inner-connecting structure of lead frame and its connecting method |
— |
2011-10-18 |
| 7884472 |
Semiconductor package having substrate ID code and its fabricating method |
Chin-Ti Chen, Ching-Wei Hung, Bing YU |
2011-02-08 |
| 7812430 |
Leadframe and semiconductor package having downset baffle paddles |
Wan-Jung Hsieh, Yu-Mei Hsu |
2010-10-12 |
| 7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package |
Wan-Jung Hsieh, Yu-Mei Hsu |
2009-11-17 |
| 7564123 |
Semiconductor package with fastened leads |
Chin-Ti Chen, Bing YU, Wan-Jung Hsieh |
2009-07-21 |
| 7549568 |
Method of forming identification code for wire-bonding machines |
Chin-Ti Chen, Bing YU |
2009-06-23 |
| 7279439 |
Rug structure |
— |
2007-10-09 |
| 6903441 |
Semiconductor package with enhanced chip groundability and method of fabricating the same |
Wen-Ta Tsai, Yuan-Ping Joe |
2005-06-07 |