Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8353101 | Method of making substrate package with through holes for high speed I/O flex cable | Charan Gurumurthy, Sanka Ganesan, Mark S. Hlad | 2013-01-15 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8353101 | Method of making substrate package with through holes for high speed I/O flex cable | Charan Gurumurthy, Sanka Ganesan, Mark S. Hlad | 2013-01-15 |