Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8446017 | Stackable wafer level package and fabricating method thereof | Jong Sik Paek, In Bae Park | 2013-05-21 |
| 8198738 | Structure of bond pad for semiconductor die and method therefor | Chan Ha Hwang, Do Hyun Na | 2012-06-12 |
| 8148724 | Liquid crystal display device and method of manufacturing the same | Hyung Beom Shin, Seok-Su Kim | 2012-04-03 |
| 8125064 | Increased I/O semiconductor package and method of making same | Do Hyun Na | 2012-02-28 |
| 7808084 | Semiconductor package with half-etched locking features | Do Hyun Na | 2010-10-05 |
| 7760317 | Thin film transistor array substrate and fabricating method thereof, liquid crystal display using the same and fabricating method thereof, and method of inspecting liquid crystal display | Byoung Ho Lim, Soon-Sung Yoo, Seung Hee Nam, Jae-Young Oh, Hong-Sik Kim +1 more | 2010-07-20 |
| 7705954 | Liquid crystal display device and method of fabricating the same | — | 2010-04-27 |
| 7550327 | Method for fabricating thin film transistor substrate | Hyun Seok Hong | 2009-06-23 |
| 7359204 | Multiple cover memory card | Sang Jae Jang, Chul-Woo Park, Jong Woon Choi, Jae Dong Kim, Choon Heung Lee | 2008-04-15 |
| 7227236 | Image sensor package and its manufacturing method | Do Hyun Na | 2007-06-05 |