Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7453148 | Structure of dielectric layers in built-up layers of wafer level package | Wen-Kun Yang, Chun-Hui Yu, Chao-Nan Chou, Chih-Wei Lin | 2008-11-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7453148 | Structure of dielectric layers in built-up layers of wafer level package | Wen-Kun Yang, Chun-Hui Yu, Chao-Nan Chou, Chih-Wei Lin | 2008-11-18 |