| 12100649 |
Package comprising an integrated device with a back side metal layer |
Wen Yin, Jay Scott Salmon |
2024-09-24 |
| 8470644 |
Exposed die package for direct surface mounting |
Frank Yu, Lance Cole Wright, Sandra Horton |
2013-06-25 |
| 8456021 |
Integrated circuit device having die bonded to the polymer side of a polymer substrate |
Shih-Chin Lin |
2013-06-04 |
| 8304871 |
Exposed die package for direct surface mounting |
Frank Yu, Lance Cole Wright, Sandra Horton |
2012-11-06 |
| 8274140 |
Semiconductor chip package assembly with deflection-resistant leadfingers |
Yuan-Pao Cheng, Li-Chaio Chou |
2012-09-25 |
| 8058706 |
Delamination resistant packaged die having support and shaped die having protruding lip on support |
Kazuaki Ano, Frank Yu, Trevor Liu |
2011-11-15 |
| 8039955 |
Mold lock on heat spreader |
Frank Yu |
2011-10-18 |
| 8008131 |
Semiconductor chip package assembly method and apparatus for countering leadfinger deformation |
Kevin Jin |
2011-08-30 |
| 7928544 |
Semiconductor chip package assembly with deflection- resistant leadfingers |
Yuan-Pao Cheng, Li-Chaio Chou |
2011-04-19 |