Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100649 | Package comprising an integrated device with a back side metal layer | Chien-Te Feng, Wen Yin | 2024-09-24 |
| 12100669 | Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methods | Anirudh Bhat | 2024-09-24 |
| 11985804 | Package comprising a block device with a shield and method of fabricating the same | Anirudh Bhat | 2024-05-14 |
| 11721639 | Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods | Anirudh Bhat | 2023-08-08 |
| 10160637 | Molded lead frame package with embedded die | Uwe Hansen | 2018-12-25 |
| 10120020 | Probe head assemblies and probe systems for testing integrated circuit devices | Roy E. Swart, Brandon Liew | 2018-11-06 |
| 10057688 | Lead frame-based chip carrier used in the fabrication of MEMS transducer packages | — | 2018-08-21 |
| 10028068 | Metalized microphone lid with integrated wire bonding shelf | — | 2018-07-17 |
| 9961452 | MEMS microphone package | — | 2018-05-01 |
| 9894444 | Microphone package with molded spacer | Kuldeep Saxena | 2018-02-13 |
| 9661421 | Microphone package with molded spacer | Kuldeep Saxena | 2017-05-23 |
| 9641940 | Metalized microphone lid with integrated wire bonding shelf | — | 2017-05-02 |
| 9319799 | Microphone package with integrated substrate | — | 2016-04-19 |
| 9238579 | Cavity package design | Eric Ochs | 2016-01-19 |
| 9002038 | MEMS microphone package with molded interconnect device | Eric Ochs | 2015-04-07 |