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Varied ball ball-grid-array (BGA) packages |
Xiao Lu, Jiongxin Lu, Alexander HUETTIS, John Harper, Jieping Zhang +5 more |
2024-02-27 |
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Surface structure method and apparatus associated with compute or electronic component packages |
Srinivasa R. Aravamudhan |
2020-02-25 |
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Method and structure for identifying lead-free solder |
Tom E. Pearson, George Arrigotti, Raiyomand Aspandiar |
2007-08-07 |
| 7183496 |
Soldered heat sink anchor and method of use |
George Arrigotti, Tom E. Pearson, Raiyomand Aspandiar |
2007-02-27 |
| 7131193 |
Heat-shrinkable retainer for PCB double-sided assembly |
Arjang Fartash, Raiyomand Aspandiar, Tom E. Pearson |
2006-11-07 |
| 6917524 |
Extension mechanism and method for assembling overhanging components |
Tom E. Pearson, George Arrigotti, Raiyomand Aspandiar |
2005-07-12 |
| 6906268 |
Heat-shrinkable retainer for PCB double-sided assembly |
Arjang Fartash, Raiyomand Aspandiar, Tom E. Pearson |
2005-06-14 |
| 6875931 |
Retainer for circuit board assembly and method for using the same |
Arjang Fartash, Raiyomand Aspandiar, Tom E. Pearson |
2005-04-05 |
| 6817878 |
Zero mounting force solder-free connector/component and method |
George Arrigotti, Ralyomand F. Aspandiar, Tom E. Pearson |
2004-11-16 |
| 6801436 |
Extension mechanism and method for assembling overhanging components |
Tom E. Pearson, George Arrigotti, Raiyomand Aspandiar |
2004-10-05 |
| 6791035 |
Interposer to couple a microelectronic device package to a circuit board |
Thomas E. Pearson, George Arrigotti, Raiyomand Aspandiar |
2004-09-14 |
| 6791189 |
Epoxy washer for retention of inverted SMT components |
Tom E. Pearson, Arjang Fartash, Raiyomand Aspandiar |
2004-09-14 |
| 6764325 |
Zero insertion force heat-activated retention pin |
George Arrigotti, Raiyomand Aspandiar, Tom E. Pearson |
2004-07-20 |
| 6734371 |
Soldered heat sink anchor and method of use |
George Arrigotti, Tom E. Pearson, Raiyomand Aspandiar |
2004-05-11 |
| 6700800 |
Retainer for circuit board assembly and method for using the same |
Arjang Fartash, Tom E. Pearson, Raiyomand Aspandiar |
2004-03-02 |
| 6691407 |
Methods for retaining assembled components |
Tom E. Pearson, Arjang Fartash, Raiyomand Aspandiar |
2004-02-17 |
| 6651869 |
Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering |
Raiyomand Aspandiar, Tom E. Pearson |
2003-11-25 |
| 6523801 |
Component placement |
Jay Hall |
2003-02-25 |
| 6501658 |
Heatsink mounting with shock absorbers |
Tom E. Pearson, Arjang Fartash, Raiyomand Aspandiar |
2002-12-31 |
| 6472612 |
Printed circuit board with embedded thermocouple junctions |
Arjang Fartash, Raiyomand Aspandiar, Tom E. Pearson |
2002-10-29 |
| D456249 |
Plastic package with pull tab |
Tom E. Pearson |
2002-04-30 |
| 5671530 |
Flip-chip mounting assembly and method with vertical wafer feeder |
Andrew R. Baker, Steven Lee Davidson, Thomas Rezsonya |
1997-09-30 |