Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740580 | Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier | Subhash Gupta, Mei Sheng Zhou | 2004-05-25 |
| 6403478 | Low pre-heat pressure CVD TiN process | Chim Seng Seet, Juan Boon Tan | 2002-06-11 |