Issued Patents All Time
Showing 101–125 of 222 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10675905 | Hybrid banknote with electronic indicia | Ronald S. Cok, Robert R. Rotzoll, Mark Willner | 2020-06-09 |
| 10620277 | Magnetic field sensor and method for making same | Christian Schott, Matthew Meitl | 2020-04-14 |
| 10600671 | Micro-transfer-printable flip-chip structures and methods | Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte | 2020-03-24 |
| 10593827 | Device source wafers with patterned dissociation interfaces | Brook Raymond, Matthew Meitl, Ronald S. Cok | 2020-03-17 |
| 10573544 | Micro-transfer printing with selective component removal | Erich Radauscher, Ronald S. Cok, Matthew Meitl | 2020-02-25 |
| 10522575 | Methods of making printable device wafers with sacrificial layers | Etienne Menard, Matthew Meitl, Joseph Carr | 2019-12-31 |
| 10522719 | Color-filter device | Ronald S. Cok, Robert R. Rotzoll, Mark Willner | 2019-12-31 |
| 10522710 | Printable inorganic semiconductor structures | Matthew Meitl, David Gomez, Carl Prevatte, Salvatore Bonafede | 2019-12-31 |
| 10510937 | Interconnection by lateral transfer printing | Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond +1 more | 2019-12-17 |
| 10505079 | Flexible devices and methods using laser lift-off | Brook Raymond, Ronald S. Cok, Matthew Meitl | 2019-12-10 |
| 10475876 | Devices with a single metal layer | Matthew Meitl, Carl Prevatte, Ronald S. Cok | 2019-11-12 |
| 10475773 | Method for producing a semiconductor component and a semiconductor component | Matthew Meitl, Tansen Varghese | 2019-11-12 |
| 10468363 | Chiplets with connection posts | Carl Prevatte, Ronald S. Cok, Matthew Meitl | 2019-11-05 |
| 10468398 | Efficiently micro-transfer printing micro-scale devices onto large-format substrates | Matthew Meitl | 2019-11-05 |
| 10446719 | Micro assembled LED displays and lighting elements | Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru +1 more | 2019-10-15 |
| 10431719 | Display with color conversion | Ronald S. Cok, Matthew Meitl | 2019-10-01 |
| 10431487 | Micro-transfer-printable flip-chip structures and methods | Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte | 2019-10-01 |
| 10418331 | Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance | — | 2019-09-17 |
| 10416425 | Concentrator-type photovoltaic (CPV) modules, receiver and sub-receivers and methods of forming same | Etienne Menard, Scott Burroughs, Joe Carr, Bob Conner, Sergiy Dets +3 more | 2019-09-17 |
| 10396238 | Printable inorganic semiconductor structures | Matthew Meitl, David Gomez, Carl Prevatte, Salvatore Bonafede | 2019-08-27 |
| 10396137 | Testing transfer-print micro-devices on wafer | Ronald S. Cok | 2019-08-27 |
| 10395966 | Micro-transfer-printable flip-chip structures and methods | Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Brook Raymond, Carl Prevatte | 2019-08-27 |
| 10395582 | Parallel redundant chiplet system with printed circuits for reduced faults | Ronald S. Cok, Robert R. Rotzoll, Matthew Meitl | 2019-08-27 |
| 10388205 | Bit-plane pulse width modulated digital display system | Ronald S. Cok, Robert R. Rotzoll | 2019-08-20 |
| 10381430 | Redistribution layer for substrate contacts | Matthew Meitl, Ronald S. Cok | 2019-08-13 |