Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812424 | Process of forming an electronic device including a ball bond | Harold Anderson | 2017-11-07 |
| 7382059 | Semiconductor package structure and method of manufacture | Harold Anderson, Yong Li Xu, James W. Mohr | 2008-06-03 |
| 7227240 | Semiconductor device with wire bond inductor and method | James H. Knapp, Francis J. Carney, Harold Anderson, Yenting Wen | 2007-06-05 |