| 12251204 |
Blood pressure monitoring system including a liquid filled sensor |
Patrick E. O'Brien, Tongbi Jiang |
2025-03-18 |
| 11561144 |
Wearable electronic device with fluid-based pressure sensing |
Brad G. Boozer, Mark G. Walsh, William S. Lee, Tongbi Jiang, Jun Zhai +6 more |
2023-01-24 |
| 11422104 |
Exposed wire-bonding for sensing liquid and water in electronic devices |
Brad G. Boozer, David MacNeil, Gregory B. Arndt, Patrick E. O'Brien, Roham Solasi +7 more |
2022-08-23 |
| 10041847 |
Various stress free sensor packages using wafer level supporting die and air gap technique |
Tongbi Jiang, Jun Zhai |
2018-08-07 |
| 9661411 |
Integrated MEMS microphone and vibration sensor |
Jun Zhai, Tongbi Jiang |
2017-05-23 |
| 9574959 |
Various stress free sensor packages using wafer level supporting die and air gap technique |
Tongbi Jiang, Jun Zhai |
2017-02-21 |
| 8969139 |
Lead frame array package with flip chip die attach |
— |
2015-03-03 |
| 8710636 |
Lead frame array package with flip chip die attach |
— |
2014-04-29 |
