Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062626 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Heejae Nam, Junggeun Shin, Hyunsu Sim, Junho Yoon +1 more | 2024-08-13 |
| 11854892 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Junho Yoon, Jungchul Lee, Junggeun Shin, Hyunsu Sim | 2023-12-26 |
| 11676914 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Heejae Nam, Junggeun Shin, Hyunsu Sim, Junho Yoon +1 more | 2023-06-13 |
| 11322405 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Junho Yoon, Jungchul Lee, Junggeun Shin, Hyunsu Sim | 2022-05-03 |
| 10256181 | Package substrates | Jingyu Kim, Taehun Kim, JiSun Hong, Se-Ho You | 2019-04-09 |
| 10032706 | Package substrates | Jingyu Kim, Taehun Kim, JiSun Hong, Se-Ho You | 2018-07-24 |