Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749539 | Maskless etching of electronic substrates via precision dispense process | Richard Korneisel, Nathaniel P. Wyckoff, Kyle B. Snyder, Jenny Calubayan | 2023-09-05 |
| 11631808 | System and device including memristor material | Kyle B. Snyder, Nathaniel P. Wyckoff, Bruce Rowenhorst, Steven J. Wiebers | 2023-04-18 |
| 11626286 | Custom photolithography masking via precision dispense process | Jenny Calubayan, Richard Korneisel, Nathaniel P. Wyckoff, Kyle B. Snyder | 2023-04-11 |
| 11605570 | Reconstituted wafer including integrated circuit die mechanically interlocked with mold material | Richard Korneisel, Nathaniel P. Wyckoff, Bret W. Simon, Jacob R. Mauermann | 2023-03-14 |
| 11515225 | Reconstituted wafer including mold material with recessed conductive feature | Richard Korneisel, Nathaniel P. Wyckoff, Bret W. Simon, Jacob R. Mauermann | 2022-11-29 |
| 11474576 | Electrical device with thermally controlled performance | Alan P. Boone, Kyle B. Snyder, Bryan M. Jefferson | 2022-10-18 |
| 11469373 | System and device including memristor material | Kyle B. Snyder, Nathaniel P. Wyckoff, Bruce Rowenhorst, Steven J. Wiebers | 2022-10-11 |
| 11462267 | System and device including memristor material | Kyle B. Snyder, Nathaniel P. Wyckoff, Bruce Rowenhorst, Steven J. Wiebers | 2022-10-04 |
| 11456418 | System and device including memristor materials in parallel | Kyle B. Snyder, Nathaniel P. Wyckoff, Bruce Rowenhorst, Steven J. Wiebers | 2022-09-27 |
| 11276641 | Conformal multi-plane material deposition | Kyle B. Snyder, Nathaniel P. Wyckoff, Bret W. Simon, Alexander S. Warren | 2022-03-15 |
| 11239182 | Controlled induced warping of electronic substrates | Richard Korneisel, Nathaniel P. Wyckoff, Jacob R. Mauermann, Carlen R. Welty | 2022-02-01 |
| 11236436 | Controlled induced warping of electronic substrates via electroplating | Richard Korneisel, Nathaniel P. Wyckoff, Jacob R. Mauermann, Carlen R. Welty | 2022-02-01 |
| 11233030 | Microfluidic manufactured mesoscopic microelectronics interconnect | Kyle B. Snyder, Alan P. Boone | 2022-01-25 |
| 10727203 | Die-in-die-cavity packaging | Reginald D. Bean, Steven J. Wiebers, Alan P. Boone | 2020-07-28 |
| 10454185 | Interferometric direction finding antenna | Jiwon L. Moran, James B. West | 2019-10-22 |
| D811878 | Keg cap holder | Michael Swartzlander | 2018-03-06 |
| 9545043 | Shielding encapsulation for electrical circuitry | Guy N. Smith, Alan P. Boone | 2017-01-10 |
| 9355544 | Method and apparatus for optically storing a binary state | Reginald D. Bean, Nathaniel P. Wyckoff | 2016-05-31 |
| 8822844 | Shielding and potting for electrical circuits | Mark T. Dimke, Luke William Horak | 2014-09-02 |
| 8585937 | Glass thick film embedded passive material | Nathan P. Lower, Ross K. Wilcoxon, Alan P. Boone, Nathaniel P. Wyckoff | 2013-11-19 |
| 8461698 | PCB external ground plane via conductive coating | Alan P. Boone, Guy N. Smith | 2013-06-11 |
| 8119040 | Glass thick film embedded passive material | Nathan P. Lower, Ross K. Wilcoxon, Alan P. Boone, Nathaniel P. Wyckoff | 2012-02-21 |