Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11950955 | Sterile covers for ultrasound probe | Gregory N. Nordgren, Hannah Marie Rundell | 2024-04-09 |
| 11948855 | Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader | Jacob R. Mauermann, Mark T. Dimke, Kaitlyn M. Fisher | 2024-04-02 |
| 11637211 | Optically clear thermal spreader for status indication within an electronics package | Ross K. Wilcoxon, Reginald D. Bean, Russell C. Tawney | 2023-04-25 |
| 11621219 | Method and apparatus for through silicon die level interconnect | Reginald D. Bean | 2023-04-04 |
| 11605570 | Reconstituted wafer including integrated circuit die mechanically interlocked with mold material | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Jacob R. Mauermann | 2023-03-14 |
| 11515225 | Reconstituted wafer including mold material with recessed conductive feature | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Jacob R. Mauermann | 2022-11-29 |
| 11502060 | Microelectronics package with enhanced thermal dissipation | Reginald D. Bean, Russell C. Tawney, Ross K. Wilcoxon | 2022-11-15 |
| 11326246 | Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition | Richard Korneisel, Nathaniel P. Wyckoff, Jacob R. Mauermann, Carlen R. Welty | 2022-05-10 |
| 11276641 | Conformal multi-plane material deposition | Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Alexander S. Warren | 2022-03-15 |
| 10799211 | Sterile covers for ultrasound probe | Gregory N. Nordgren, Hannah Marie Rundell | 2020-10-13 |
| 10187987 | Interconnect assembly with flexible circuit | Russell C. Tawney | 2019-01-22 |
| 9589913 | Flip chip stacking utilizing interposer | Sarah M. Shepard, Alan P. Boone | 2017-03-07 |