Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948855 | Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader | Bret W. Simon, Mark T. Dimke, Kaitlyn M. Fisher | 2024-04-02 |
| 11605570 | Reconstituted wafer including integrated circuit die mechanically interlocked with mold material | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bret W. Simon | 2023-03-14 |
| 11515225 | Reconstituted wafer including mold material with recessed conductive feature | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Bret W. Simon | 2022-11-29 |
| 11326246 | Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition | Richard Korneisel, Nathaniel P. Wyckoff, Bret W. Simon, Carlen R. Welty | 2022-05-10 |
| 11236436 | Controlled induced warping of electronic substrates via electroplating | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Carlen R. Welty | 2022-02-01 |
| 11239182 | Controlled induced warping of electronic substrates | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Carlen R. Welty | 2022-02-01 |