Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948855 | Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader | Bret W. Simon, Jacob R. Mauermann, Kaitlyn M. Fisher | 2024-04-02 |
| 8822844 | Shielding and potting for electrical circuits | Brandon C. Hamilton, Luke William Horak | 2014-09-02 |
| 8640619 | Use of polyamide thermal plastics as low cost electronics potting compounds for munitions applications | Marty B. McGregor, Alan P. Boone | 2014-02-04 |
| 6677468 | Methods of reducing chloride content in epoxy compounds | Richard E. Miller | 2004-01-13 |
| 6211389 | Methods of reducing the chloride content of epoxy compounds | — | 2001-04-03 |