Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6421254 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco | 2002-07-16 |
| 6266246 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco | 2001-07-24 |
| 6031720 | Cooling system for semiconductor die carrier | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Moises Behar, Arindum Dutta, Kevin Link | 2000-02-29 |
| 6016256 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco | 2000-01-18 |