| 9627360 |
Circuit board having bypass pad |
Sang-Guk Han, Seok-Joon Moon |
2017-04-18 |
| 9449716 |
Circuit board having bypass pad |
Sang-Guk Han, Seok-Joon Moon |
2016-09-20 |
| 9373633 |
Methods of forming non-volatile memory devices including vertical NAND strings |
Byung-Seo Kim, Sung Dong KIM |
2016-06-21 |
| 9171644 |
Circuit board having bypass pad |
Sang-Guk Han, Seok-Joon Moon |
2015-10-27 |
| 9069036 |
Circuit board having bypass pad |
Sang-Guk Han, Seok-Joon Moon |
2015-06-30 |
| 8971118 |
Methods of forming non-volatile memory devices including vertical NAND strings |
Byung-Seo Kim, Sung Dong KIM |
2015-03-03 |
| 8917107 |
Circuit board having bypass pad |
Sang-Guk Han, Seok-Joon Moon |
2014-12-23 |
| 8659946 |
Non-volatile memory devices including vertical NAND strings and methods of forming the same |
Byung-Seo Kim, Sung Dong KIM |
2014-02-25 |
| 8325527 |
Non-volatile memory devices including vertical NAND strings and methods of forming the same |
Byung-Seo Kim, Sung Dong KIM |
2012-12-04 |
| 7785964 |
Non-volatile semiconductor memory device and method of manufacturing the same |
Jin-Jun Park, Hee Jin Kwak |
2010-08-31 |
| 7399670 |
Methods of forming different gate structures in NMOS and PMOS regions and gate structures so formed |
Taek-Soo Jeon, Yu-Gyun Shin, Sang-Bom Kang, Hong-Bae Park, Hag-Ju Cho +2 more |
2008-07-15 |
| 7271408 |
Semiconductor device test patterns and related methods for precisely measuring leakage currents in semiconductor cell transistors |
Young-Pil Kim |
2007-09-18 |
| 7153750 |
Methods of forming capacitors of semiconductor devices including silicon-germanium and metallic electrodes |
Eun-Ae Chung, Ki-Hyun Hwang, Jung-Hwan Oh, Hyo Jung Kim, Seok-Woo Nam +4 more |
2006-12-26 |
| 7060575 |
Semiconductor device having transistor and method of manufacturing the same |
Byeong-yun Nam, Young-Pil Kim |
2006-06-13 |
| 7009257 |
Methods of manufacturing integrated circuit devices having reduced contact resistance between a substrate and a contact pad while maintaining separation of the substrate and the contact pad and integrated circuit devices formed thereby |
Young-Pil Kim, Hyoung Joon Kim, Byeong-yun Nam |
2006-03-07 |
| 6984568 |
Semiconductor memory device having multi-layered storage node contact plug and method for fabricating the same |
Byeong-yun Nam |
2006-01-10 |
| 6897109 |
Methods of manufacturing integrated circuit devices having contact holes using multiple insulating layers |
Young-Pil Kim |
2005-05-24 |
| 6818551 |
Methods of forming contact holes using multiple insulating layers |
Young-Pil Kim |
2004-11-16 |
| 6689654 |
Methods of manufacturing integrated circuit devices having reduced contact resistance between a substrate and a contact pad while maintaining separation of the substrate and the contact pad |
Young-Pil Kim, Hyoung Joon Kim, Byeong-yun Nam |
2004-02-10 |
| 6664585 |
Semiconductor memory device having multilayered storage node contact plug and method for fabricating the same |
Byeong-yun Nam |
2003-12-16 |
| 6576963 |
Semiconductor device having transistor |
Byeong-yun Nam, Young-Pil Kim |
2003-06-10 |
