Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368423 | Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2016-06-14 |
| 9190349 | Integrated circuit packaging system with leadframe and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2015-11-17 |
| 9142530 | Coreless integrated circuit packaging system and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Sung-Soo Kim, In Sang Yoon | 2015-09-22 |
| 9105620 | Integrated circuit packaging system with routable traces and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2015-08-11 |
| 8937379 | Integrated circuit packaging system with trenched leadframe and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2015-01-20 |
| 7901988 | Method for forming a package-on-package structure | Vincent Ho | 2011-03-08 |