Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8981864 | Multi-layer integrated transmission line circuits having a metal routing layer that reduces dielectric losses | Daniel Gerlach | 2015-03-17 |
| 8370777 | Method of generating a leadframe IC package model, a leadframe modeler and an IC design system | Donald E. Hawk, Stephen M. King, Jeffrey Klemovage, John J. Krantz, Allen S. Lim +1 more | 2013-02-05 |
| 8084857 | Method and article of manufacture for wire bonding with staggered differential wire bond pairs | Gavin Appel, Christopher J. Wittensoldner | 2011-12-27 |
| 7675168 | Integrated circuit with staggered differential wire bond pairs | Gavin Appel, Christopher J. Wittensoldner | 2010-03-09 |
| 7671450 | Integrated circuit package for high-speed signals | Ellis E. Nease, Christopher J. Wittensoldner | 2010-03-02 |
| 7667321 | Wire bonding method and related device for high-frequency applications | Todd Snider | 2010-02-23 |