Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9153543 | Shielding technique for semiconductor package including metal lid and metalized contact area | Marc Alan Mangrum | 2015-10-06 |
| 6962829 | Method of making near chip size integrated circuit package | Thomas P. Glenn, Roy Dale Hollaway | 2005-11-08 |
| 6268654 | Integrated circuit package having adhesive bead supporting planar lid above planar substrate | Thomas P. Glenn, Roy Dale Hollaway | 2001-07-31 |
| 6228676 | Near chip size integrated circuit package | Thomas P. Glenn, Roy Dale Hollaway | 2001-05-08 |
| 6117705 | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate | Thomas P. Glenn, Roy Dale Hollaway | 2000-09-12 |
| 6034429 | Integrated circuit package | Thomas P. Glenn, Roy Dale Hollaway | 2000-03-07 |
| 5981314 | Near chip size integrated circuit package | Thomas P. Glenn, Roy Dale Hollaway | 1999-11-09 |
| 5950074 | Method of making an integrated circuit package | Thomas P. Glenn, Roy Dale Hollaway | 1999-09-07 |
| 5796163 | Solder ball joint | Thomas P. Glenn, Roy Dale Hollaway | 1998-08-18 |
| 5796586 | Substrate board having an anti-adhesive solder mask | Shaw Wei Lee, Poh Ling Lee | 1998-08-18 |
| 5620928 | Ultra thin ball grid array using a flex tape or printed wiring board substrate and method | Shaw Wei Lee, Jagdish G. Belani | 1997-04-15 |