| 8357999 |
Assembly having stacked die mounted on substrate |
Marc E. Robinson, Donald Almen, Larry Jacobsen |
2013-01-22 |
| 7535109 |
Die assembly having electrical interconnect |
Marc E. Robinson, Donald Almen, Larry Jacobsen |
2009-05-19 |
| 6271598 |
Conductive epoxy flip-chip on chip |
Marc E. Robinson, William R. Scharrenberg |
2001-08-07 |
| 6255726 |
Vertical interconnect process for silicon segments with dielectric isolation |
Kenneth M. Sautter |
2001-07-03 |
| 6177296 |
Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
Kenneth M. Sautter |
2001-01-23 |
| 6124633 |
Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
Kenneth M. Sautter |
2000-09-26 |
| 6098278 |
Method for forming conductive epoxy flip-chip on chip |
Marc E. Robinson, William R. Scharrenberg |
2000-08-08 |
| 6080596 |
Method for forming vertical interconnect process for silicon segments with dielectric isolation |
Kenneth M. Sautter |
2000-06-27 |
| 5891761 |
Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
Kenneth M. Sautter |
1999-04-06 |