Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4478883 | Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate | James R. Bupp, Voya R. Markovich, Carlos J. Sambucetti | 1984-10-23 |